IC 분석 사례
EMC burnt external inspection & die melt de-capsulation analysis
Display Drive IC 분석 사례
Non-destructive X-ray analysis
Short or leakage failure curve trace & fault localization
ESD Protection Circuit De-layer 분석 사례
Metal 4 layer
Metal 3 layer
Metal 2 layer
Metal 1 layer
Gate layer
BGA IC Solder 분석 사례
BGA IC solder cross section analysis & size measurement
MLCC 분석 사례
MLCC cross section analysis (electrode melt)
정품 식별 분석 사례
[정상 제품]
[의심 제품]
Counterfeit analysis: external marking design, blacktop, re-plating, lead frame design,
die design, die logo and manufacturer
die design, die logo and manufacturer
