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Introduction to test analysis technology
Provides test and analysis services for modules, electronic components and semiconductor devices constituting the system

01

Defect analysis service

Defect analysis service

  • External inspection

electrical analysis

  • I/V curve 측정
  • LCR 측정

Physical analysis (non-destructive/destructive)

  • Cross section
  • De-capsulation
  • De-layer
  • EMMI (Photon, Thermal, OBIRCH)
  • X-ray (2D, 3D)
  • SEM / EDS

Failure cause analysis

Analysis processor consulting

02

Counterfeit analysis service

  • Semiconductor IC, authenticity analysis
  • sensor, genuine analysis
  • module, genuine use analysis

03

Reverse Engineering

  • PCB structure analysis
  • Package structure analysis
  • Chip structure analysis

04

Specimen pretreatment service

  • De-cap service for FIB
  • IC extraction