Provides test and analysis services for modules, electronic components and semiconductor devices constituting the system
01
Defect analysis service
Defect analysis service
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External inspection
electrical analysis
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I/V curve 측정
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LCR 측정
Physical analysis (non-destructive/destructive)
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Cross section
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De-capsulation
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De-layer
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EMMI (Photon, Thermal, OBIRCH)
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X-ray (2D, 3D)
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SEM / EDS
Failure cause analysis
Analysis processor consulting
02
Counterfeit analysis service
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Semiconductor IC, authenticity analysis
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sensor, genuine analysis
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module, genuine use analysis
03
Reverse Engineering
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PCB structure analysis
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Package structure analysis
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Chip structure analysis
04
Specimen pretreatment service
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De-cap service for FIB
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IC extraction